Reclaim Wafer 

★ Wafer size : 150 / 200 / 300 mm
★ Service : Polishing / Film Removing / Pattern Removing；Warpage/ Crystal Orientation  Measurement
★Particle control : 0.3μm / 0.2μm / 0.12μm / 90 nm / 60 nm / 40 nm / 32 nm
★ COA : base on customers’requirements including particle control
★ Wafer surface inspection( Scratches / edge chips / film / crack / slip) / P/N TYPE / Electric resistance
    / TTV / BOW / Warpage